| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| BCT642AEGG-TR | 存储IC |
BROADCHIP/广芯 |
QFN3.4x2.5-24L |
24+ |
81000 |
|||
| W29N02GVSIAA | 存储IC |
WINBOND/华邦 |
24+ |
7680 |
||||
| W9751G6NB-25 | 存储IC |
WINBOND/华邦 |
24+ |
16720 |
||||
| K4F6E3S4HM-MGCJ | 存储IC |
SAMSUNG/三星 |
BGA200 |
24+ |
4000 |
|||
| W634GU6QB-11 | 存储IC |
WINBOND/华邦 |
24+ |
15840 |
||||
| W25Q128JVSIQ | 存储IC |
华邦/WINBOND |
SOP8 |
24+ |
108000 |
|||
| W632GU6NB-11 | 存储IC |
WINBOND/华邦 |
24+ |
15840 |
||||
| W631GU6NB-11 | 存储IC |
WINBOND/华邦 |
24+ |
15840 |
||||
| W9825G6KH-6 | 存储IC |
WINBOND/华邦 |
TSOPII-54 |
24+ |
3456 |
|||
| W971GG6NB-25 | 存储IC |
WINBOND/华邦 |
24+ |
16720 |
||||
| AT24C02C-STUM-T | 存储IC |
MICROCHIP/微芯 |
SOT-23-5 |
24+ |
40000 |
|||
| K4E6E304ED-EGCG | 存储IC |
SAMSUNG/三星 |
BGA-178 |
24+ |
112000 |
|||
| W25Q32JVUUIQT | 存储IC |
WINBOND/华邦 |
USON-84X3 |
24+ |
12000 |
|||
| BCT646B | 存储IC |
BROADCHIP/广芯 |
WLCSP-36L |
24+ |
30000 |
|||
| W9825G6KH-5I | 存储IC |
WINBOND/华邦 |
TSOP-54 |
24+ |
12000 |
|||
| W25Q256JWPIMT | 存储IC |
WINBOND/华邦 |
8-WDFN |
24+ |
8000 |
|||
| W29N02GVSIAA | 存储IC |
WINBOND/华邦 |
TSOP-48 |
24+ |
1728 |
|||
| W25Q20CLSNIG | 存储IC |
WINBOND/华邦 |
SOP-8 |
24+ |
12000 |
|||
| W25Q16JVSSIQ | 存储IC |
WINBOND/华邦 |
SOP |
24+ |
36000 |
|||
| BCT646C | 存储IC |
BROADCHIP/广芯 |
FO-36L |
24+ |
30000 |
|||
| AD8251ARMZ-R7 | 存储IC |
ADI/亚德诺 |
MSOP10 |
24+ |
2000 |
|||
| AD5624RBRMZ-5REEL7 | 存储IC |
ADI/亚德诺 |
MSOP10 |
24+ |
2000 |
|||
| 74LVC8T245PW-Q100 | 存储IC |
NEXPERIA/安世 |
TSSOP24 |
24+ |
10000 |
|||
| OP4177ARZ | 存储IC |
ADI/亚德诺 |
TSSOP16 |
24+ |
888 |
|||
| NT5CC256M16DP-DI | 存储IC |
NANYA/南亚 |
BGA |
24+ |
5000 |
|||
| NT5CC128M16JR-EK | 存储IC |
NANYA/南亚 |
BGA |
24+ |
5000 |
|||
| MT41K128M16JT-125IT:K | 存储IC |
MICROM/镁光 |
FBGA96 |
24+ |
1000 |
|||
| ME6210A33PG | 存储IC |
MICRONE/微盟 |
SOT-89-3 |
24+ |
30000 |
|||
| ME2169AM6G | 存储IC |
MICRONE/微盟 |
SOT23-6 |
24+ |
30000 |
|||
| PMF250XNEX | 存储IC |
NEXPERIA/安世 |
SOT-323 |
24+ |
45000 |