| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K4F6E3S4HM-MGCJ | 存储IC |
SAMSUNG/三星 |
BGA200 |
24+ |
4000 |
|||
| BCT642AEGG-TR | 存储IC |
BROADCHIP/广芯 |
QFN3.4x2.5-24L |
24+ |
81000 |
|||
| W29N02GVSIAA | 存储IC |
WINBOND/华邦 |
24+ |
7680 |
||||
| W9751G6NB-25 | 存储IC |
WINBOND/华邦 |
24+ |
16720 |
||||
| W634GU6QB-11 | 存储IC |
WINBOND/华邦 |
24+ |
15840 |
||||
| W971GG6NB-25 | 存储IC |
WINBOND/华邦 |
24+ |
16720 |
||||
| W25Q128JVSIQ | 存储IC |
华邦/WINBOND |
SOP8 |
24+ |
108000 |
|||
| W632GU6NB-11 | 存储IC |
WINBOND/华邦 |
24+ |
15840 |
||||
| W631GU6NB-11 | 存储IC |
WINBOND/华邦 |
24+ |
15840 |
||||
| W9825G6KH-6 | 存储IC |
WINBOND/华邦 |
TSOPII-54 |
24+ |
3456 |
|||
| W25Q128JVSIQ | 存储IC |
WINBOND/华邦 |
SOIC-8L |
24+ |
18000 |
|||
| BCT644B | 存储IC |
BROADCHIP/广芯 |
WLCSP-36L |
24+ |
30000 |
|||
| W9751G6NB-25 | 存储IC |
WINBOND/华邦 |
VFBGA-84 |
24+ |
5016 |
|||
| W25Q80DVSNIG | 存储IC |
WINBOND/华邦 |
SOP |
24+ |
25000 |
|||
| W25N01GVZEIG | 存储IC |
WINBOND/华邦 |
SOP |
24+ |
4000 |
|||
| W25Q64FWSSIG | 存储IC |
WINBOND/华邦 |
SOP-8 |
24+ |
12000 |
|||
| TMS37145TEAIE | 存储IC |
ADI/亚德诺 |
SOT385 |
24+ |
20000 |
|||
| PIC24HJ128GP506-I/PT | 存储IC |
MICROCHIP/微芯 |
TQFP-64 |
24+ |
7040 |
|||
| ME4075AM5G | 存储IC |
MICRONE/微盟 |
SOT23-5 |
24+ |
30000 |
|||
| ME8165DD7G | 存储IC |
MICRONE/微盟 |
DIP7 |
24+ |
30000 |
|||
| ME6206A30PG | 存储IC |
MICRONE/微盟 |
SOT89 |
24+ |
30000 |
|||
| ME6206A33XG | 存储IC |
MICRONE/微盟 |
SOT23 |
24+ |
30000 |
|||
| LTC3260EMSE#TRPBF | 存储IC |
ADI/亚德诺 |
MSOP16 |
24+ |
5000 |
|||
| LTC4417IGN#PBF | 存储IC |
ADI/亚德诺 |
SSOP-24 |
24+ |
770 |
|||
| LT8609AIMSE#TRPBF | 存储IC |
ADI/亚德诺 |
MSOOP10 |
24+ |
5000 |
|||
| LT8610ABEMSE#PBF | 存储IC |
ADI/亚德诺 |
MSOP16 |
24+ |
5032 |
|||
| LT8301ES5#WTRPBF | 存储IC |
ADI/亚德诺 |
SOT23 |
24+ |
10000 |
|||
| LFXP2-17E-5QN208C | 存储IC |
LATTICE/莱迪斯 |
QFP208 |
24+ |
3000 |
|||
| RS70B16G4S01F | 存储IC |
ARTMEM/妙存科技 |
24+ |
10500 |
||||
| RS128M16V8DB-107AT | 存储IC |
RAYSON/晶存 |
FBGA96-ball |
24+ |
1022 |